Published on: 20-5-2019

On Thursday May 9th, the BCSEMI NL membership meeting was hosted by Nexperia in Nijmegen.
Topic of the afternoon was “The future in Packaging”.

With over 50 attendees the meeting was well visited. We were welcomed in the 52 Degrees building were the meeting took place on the 17th floor. The view over Nijmegen was extraordinary.
Managing Director of BCSEMI NL Barry Peet opened the meeting, with an update on BCSEMI NL’s activities.

 

Challenges in Semiconductor Packaging

 • By René Poelma 

René Poelma (Nexperia) presented “Challenges in Semiconductor Packaging”, on challenges regarding the Constraints and Requirements of the customer, Economic sustainability, Quality, Time, Manufacturability, Competitiveness, Environmental sustainability etc.

 

High Precision Assembly & Packaging

 • By Bibi Visnjicki & Marten Kehayan 

Bibi Visnjicki and Marten Kehayan, (both of Fraunhofer IMS located at the Universiteit Twente) gave the presentation “High Precision Assembly & Packaging” on the history of Fraunhofer, the current status and the importance of Fraunhofer’s presence in the Netherlands and the technical challenges the Fraunhofer project Center is facing.

 

Vision and directions in High Volume chip assembly equipment

 • By Jelle Ardan & Patrick Deenen 

In the last presentation “Vision and directions in High Volume chip assembly equipment”, Jelle Ardan and Patrick Deenen took us into the optimization process of stock availability and production planning. By creating algorithms they are able to optimize the processes.

 

After Boudewijn van Blokland had shown a short movie about the past and developments of ITEC (Nexperia) the meeting was completed by a guided tour at ITEC (Nexperia).

It was a good, interesting meeting, witnessed by enthusiastic reactions from the participants during the closing networking drinks.

We hope to meet you (again), during one of our future BCSEMI NL Events. 

 

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