BE Semiconductor Industries

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BE Semiconductor Industries N.V. and its subsidiaries is a leading manufacturer of semiconductor die sorting, flip chip and multi-chip die bonding, wire bonding, packaging and plating equipment, for both array connect and leadframe assembly processes.
Our technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or “packages”, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. Our innovative systems offer customers high productivity and improved yields of defect-free devices at a low total cost of ownership. Our products are used to assemble chips for a wide variety of end-use applications including electronics, computer, automotive, industrial, RFID (“Radio Frequency Identification Device”) and solar energy.

Besi products Overview

Die Bonding Equipment

  • Single-, multi-chip and flip chip die bonding systems which place the chips onto a multi-layer substrate for reliable interconnection without goldwires.
  • Die sorting systems which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations.
Packaging Equipment
  • Molding systems that encapsulate bonded and/or stacked semiconductor devices in epoxy resin. 
  • Trim and form systems used to cut and form metallic leads of encapsulated semiconductor devices in leadframe applications, possibly printed by laser and packed in tubes, reel or tray 
  • Singulation systems used to cut packaged array connect devices and printed circuit boards.
Plating Equipment
  • Fully automated tin plating and spot plating systems for conventional leadframe applications. 
  • Flexible antenna plating systems for new RFID and thin film solar cell applications.
The Company is engaged in one line of business, the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry.

Our customers are primarily leading U.S., European and Asian semiconductor manufacturers, assembly subcontractors and electronics and industrial companies including Amkor, ASE, Chipmos, Epcos, Fairchild, Hynix, Infineon, Osram, UTAC, Robert Bosch, Samsung, Siliconware, Skyworks, STMicroelectronics and Texas Instruments. Our equipment performs critical functions in our customers’ semiconductor assembly operations and in many cases represents a significant percentage of their installed base of assembly equipment. Our business has benefited from close, long-term relationships with our customers, many of whom have been purchasing our equipment and services for over 35 years.

Besi Organization Structure

BE Semiconductor Industries
 
Sector
Semiconductor
Location in East Netherlands
Duiven
Activities in East Netherlands
Manufacturing, R&D, Marketing and Sales
Number employed in East Netherlands
Ca 250
Country of origin
The Netherlands

For more information: www.besi.com

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