We develop and manufacture packages for semiconductor components and systems. State-of-the-art, TS16949 certified production and assembly lines in the Netherlands and the Philippines deliver everything from prototypes right up to volume runs of several million units per product.
Customized packages are delivered for a wide range of customers and applications, including but not limited to the automotive, industrial and medical markets. Their devices include sensors (optical, pressure, humidity, chemical, blood and ultrasonic), RF modules, opto-electronics/photonics and MEMS. Calling on a range of technologies – from exposed die and QFN map moldings to our flagship nCapsulate – we can help you at any or all stages of package development for your device. Even when it comes to combining of electrical and mechanical components. Whether it is package development, prototyping or volume manufacture, or even taking care of your component supply management, we are here to support you from concept and throughout device lifetime.
Our mission is to be a world class competence center offering development and manufacturing of functional semiconductor assembly solutions. Collaborating with us will help you reduce the time between product conception and its introduction to the market place. By combining your expertise at system level with our creativity and know-how of packaging, we can make a winning team.
We delight in each new customer request, which offers us an opportunity to demonstrate our expertise in package technologies.