ALSI NV, Advanced Laser Separation International NV, was founded in the year 2000 as a spin-off from NXP (founded by Philips).
ALSI today’s organization has a strong focus on Innovation and Process Development fitting the needs of the semiconductor industry. Next to the organization of internal skills and competences in relation to ALSI’s core-competences, ALSI is in a continuous process of alignment of added value processes with external partners. This enables ALSI to manage all relevant business functions within a industrial virtual environment of experienced semiconductor companies ALSI has created an international network of industrial and knowledge organizations.
ALSI is in the centre of this industrial network, organizing and managing complementary technological competences and aligning added value processes within the network to serve our customers faster and better.
New applications in the semiconductor industry challenge increasingly the use of standard wafer dicing techniques; thin wafers, brittle material, low-k materials, etc.
For many of these new applications ALSI’s laser technology offers the ideal solution. Additionally ALSI’s multiple laser beam process results in fast throughput times and small dicing street width (< 30 micron), which considerably reduces the Cost of Ownership for semiconductor manufacturers.
ALSI’s proprietary multiple beam technology is the only mature laser dicing process that has been proven in high volume production for many years; since more than ten years two major semiconductor companies have been using this laser singulation for dicing small signal transistors and diodes at an annual volume in excess of 10 bill. pcs.
ALSI strategy and ambition is on becoming the technology leader in the field of laser dicing and to become the leading supplier of laser separation systems to the semiconductor industry.
- ALSI design philosophy
The Application Lab is fully equipped to laser dice your wafer and convince you of our unique laser dicing technique.